【英文标准名称】:Workmanshiprequirementsforsolderedelectronicassemblies-Through-holemountassemblies
【原文标准名称】:钎焊电子组件的工艺要求.通孔安装组件
【标准号】:BSEN61192-3-2003
【标准状态】:现行
【国别】:英国
【发布日期】:2003-04-07
【实施或试行日期】:2003-04-07
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:
【摘要】:ThispartofIEC61192specifiesgeneralrequirementsforworkmanshipinthrough-holemountsolderedassembliesonorganicsubstrates,onprintedboards,andonsimilarlaminatesattachedtothesurface(s)ofinorganicsubstrates.Itappliestoassembliesthataretotallythrough-holeormixedassembliesthatincludesurface-mountingorotherrelatedassemblytechnologies,forexample,terminals,wires.
【中国标准分类号】:J33
【国际标准分类号】:31_190
【页数】:50P;A4
【正文语种】:英语


Product Code:SAE AMS3970/1
Title:Carbon Fiber Fabric Repair Prepreg, 120 掳C (250 掳F) Vacuum Curing, Part 1 - General Requirements
Issuing Committee:Ams Cacrc Commercial Aircraft Composite Repair Committee
Scope:AMS3970/1 gives information about the technical requirements and qualification procedure for carbon fiber fabric epoxy prepreg and a companion non-structural glass prepreg used for repair of carbon fiber reinforced epoxy structures. The prepreg system may include a film adhesive to be applied in a co-curing process with the prepreg for joint and sandwich bonding. The need for a film adhesive shall be established during screening tests.